Shivakumar Hunagund, MS
Senior Research Engineer, Material Failure Analysis
Virginia Commonwealth University, Chandler, United States
Biography
I am a Senior Yield Development Engineer at Intel, Chandler, with 15 years of R&D experience in the US and Europe, working on Semiconductors, Nanofabrication, Micro-Optics, Failure Analysis, Advanced Materials, and Emerging Computing Systems. I have a BSc (Hon.) degree in Nanotechnology from University of Leeds, UK, an MSc in Quantum Information and Optics from the Sapienza University of Rome, Italy, and a MS in Nuclear Engineering from Virginia Commonwealth University, US. While at Intel, I have made significant contribution in the development of 7nm backend etch process and device characterization methodologies for advanced electronic packaging. I have over a decade work experience at various research Institutes across Europe. I have been elected to the grade of Senior IEEE Member and life time member of Sigma Xi - A Scientific Honorary society. I have authored over 20 publications in journals and conference proceedings, contributed to 5 book chapters, and currently serve on the editorial review board of the International Journal of Imaging and Sensing Technologies and Applications.
Research Interest
Magnetic materials, Optical materials, Failure analysis, Nanofabrication, Quantum computing
